Apparatus and method for selective area deposition of thin films on electrically biased substrates

Patent · Tue Oct 11 00:00:00 EDT 1994

OSTI ID:6825221

Zuhr, R A; Haynes, T E; Golanski, A

An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.

• DOE Contract Number: AC05-84OR21400
• Assignee: Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
• Patent Number(s): US 5354583; A
• Application Number: PPN: US 7-972778
• OSTI ID: 6825221
• Resource Relation: Patent File Date: 9 Nov 1992
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
THIN FILMS
ENERGY BEAM DEPOSITION
ELECTRIC POTENTIAL
EQUIPMENT
SUBSTRATES
DEPOSITION
FILMS
SURFACE COATING
360101* - Metals & Alloys- Preparation & Fabrication
360201 - Ceramics
Cermets
& Refractories- Preparation & Fabrication
360601 - Other Materials- Preparation & Manufacture