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Title: Conventional wallboard with latent heat storage for passive solar applications

Conference ·

Conventional wallboard impregnated with octadecane paraffin (Melting Point -- 73.5{degree}F) is being developed as a building material with latent heat storage for passive solar applications. Impregnation was accomplished simply by soaking the wallboard in molten paraffin. Concentrations of paraffin in the combined product as high as 35{percent} by weight were achieved. In support of this concept, a computer model was developed to describe thermal transport and storage by a phase change material (PCM) dispersed in a porous media. The computer model was confirmed by comparison with known analytical solutions where the PCM melts at a specific melting point. However, agreement between the model and an experimentally produced thermal transient involving impregnated wallboard was only good after the model was modified to allow the paraffin to melt over a temperature range. This was accomplished by replacing the heat of fusion with a triangular heat capacity relationship that mimics the triangular melt curve found through differential scanning calorimetry. When this change was made, agreement between the model and the experimental transient was very good. 4 refs., 8 figs.

Research Organization:
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Sponsoring Organization:
DOE/CE
DOE Contract Number:
AC05-84OR21400
OSTI ID:
6816636
Report Number(s):
CONF-900801-14; ON: DE90012136
Resource Relation:
Journal Volume: 4; Conference: 25. intersociety energy conversion engineering conference, Reno, NV (USA), 12-17 Aug 1990
Country of Publication:
United States
Language:
English