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Title: Effects of load and thermal histories on mechanical behavior of materials; Proceedings of the Symposium, Denver, CO, Feb. 25, 26, 1987

Conference ·
OSTI ID:6730738

This volume includes topics on fatigue crack propagation; isothermal and thermal-mechanical fatigue; and microstructure, fracture, and damage. Papers are presented on transients in fatigue crack growth, elevated-temperature fatigue crack propagation, the role of crack closure in crack retardation in P/M and I/M aluminum alloys, the acoustic interrogation of fatigue overload effects, and the effects of frequency and environment on crack growth in Inconel 718. Special attention is given to isothermal fatigue failure mechanisms in low-tin lead-based solder, the stress and strain controlled low-cycle fatigue of Pb-Sn solder for electronic packaging applications, load sequence effects on the deformation of isolated microplastic grains, and thermal fatigue of stainless steel. Other papers are on the influence of thermal aging on the creep crack growth behavior of a Cr-Mo steel, the effect of cyclic loading on the fracture toughness of a modified 4340 steel, and the effects of hot rolling condition and boron microalloying on phase transformation and microstructure in niobium-bearing interstitial free steel.

OSTI ID:
6730738
Report Number(s):
CONF-8702162-
Resource Relation:
Conference: Effects of load and thermal histories on mechanical behavior of materials symposium, Denver, CO, USA, 25 Feb 1987
Country of Publication:
United States
Language:
English