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Title: Bond properties of liquid adhesive

Technical Report ·
OSTI ID:6717199

Studies were conducted on a liquid adhesive used to bond circuit laminates to rigid plastic components. Areas investigated include: adhesive formulation, factors influencing bond strength, laminate cleaning, and automated adhesive application.

Research Organization:
Bendix Corp., Kansas City, MO (USA)
DOE Contract Number:
AC04-76DP00613
OSTI ID:
6717199
Report Number(s):
BDX-613-2833; ON: DE83001743
Country of Publication:
United States
Language:
English