Copper foil adhesion within polyimide/glass multilayer printed wiring boards: Final report
Technical Report
·
OSTI ID:6580769
Copper foil adhesion to polyimide/glass prepreg was evaluated. Typical peel strength obtained between prepreg and the smooth side of the copper foil was 1 to 3 lb./in. width. Peel strength between prepreg and the rough side of the copper foil ranged between 6 and 7 lb./in. width. An alternate test for evaluating the integrity of multilayer printed wiring boards is described.
- Research Organization:
- Allied Corp., Kansas City, MO (USA). Bendix Kansas City Div.
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6580769
- Report Number(s):
- BDX-613-3743; ON: DE87009100
- Country of Publication:
- United States
- Language:
- English
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