Multiwire conductor having greatly increased interwire resistance and method for making same

Patent · Mon Mar 15 00:00:00 EST 1982

OSTI ID:6535780

Luhman, T; Suenaga, M

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

• DOE Contract Number: AC02-76CH00016
• Assignee: Dept. of Energy
• Application Number: ON: DE83006866
• OSTI ID: 6535780
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
SUPERCONDUCTING WIRES
FABRICATION
COPPER ALLOYS
INTERMETALLIC COMPOUNDS
MANUFACTURING
SUPERCONDUCTING MAGNETS
TIN
TIN ALLOYS
ALLOYS
ELECTRICAL EQUIPMENT
ELECTROMAGNETS
ELEMENTS
EQUIPMENT
MAGNETS
METALS
SUPERCONDUCTING DEVICES
WIRES
420201* - Engineering- Cryogenic Equipment & Devices