Surface relief produced by diffusion induced boundary migration in Cu-Zn

Journal Article · Thu Mar 01 00:00:00 EST 1984 · Metall. Trans., A; (United States)

DOI:https://doi.org/10.1007/BF02644973· OSTI ID:6468544

Tsai, Y S; Meyrick, G; Shewmon, P G

Experimental observations are presented that demonstrate that diffusion induced grain boundary migration in copper foils exposed to zinc vapor, from a Cu-15 pct Zn alloy, can be studied directl after treatment without etching. The general characteristics of migration are in accord with previous investigations, but novel changes in the surface topography are described. Pits were formed on the surface of areas swept by boundary migration; also, the surface was often converted into a series of corrugations. The formation of pits suggests that the grain boundary diffusivity of zinc exceeds that of copper. The corrugations are believed to indicate that boundaries sometimes move in an intermittent manner.

• Research Organization: Department of Metallurgical Engineering, The Ohio State University, Columbus, OH
• OSTI ID: 6468544
• Journal Information: Metall. Trans., A; (United States), Vol. 15A:3
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER BASE ALLOYS
GRAIN BOUNDARIES
HEAT TREATMENTS
THERMAL DIFFUSION
MIGRATION
ZINC ALLOYS
CAVITIES
FOILS
SURFACE PROPERTIES
VAPORS
ALLOYS
COPPER ALLOYS
CRYSTAL STRUCTURE
DIFFUSION
FLUIDS
GASES
MICROSTRUCTURE
360101* - Metals & Alloys- Preparation & Fabrication