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Title: Electrophoretically active sol-gel processes to backfill, seal, and/or densify porous, flawed, and/or cracked coatings on electrically conductive material

Patent ·
OSTI ID:6439335

Electrophoretically active sol-gel processes to fill, seal, and/or density porous, flawed, and/or cracked coatings on electrically conductive substrates. Such coatings may be dielectrics, ceramics, or semiconductors and, by the present invention, may have deposited onto and into them sol-gel ceramic precursor compounds which are subsequently converted to sol-gel ceramics to yield composite materials with various tailored properties. 6 figs.

Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corp., Albuquerque, NM (United States)
Patent Number(s):
US 5925228; A
Application Number:
PPN: US 8-781069
OSTI ID:
6439335
Resource Relation:
Patent File Date: 9 Jan 1997
Country of Publication:
United States
Language:
English