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Title: Use of separate ZnTe interface layers to form ohmic contacts to p-CdTe films

Patent ·
OSTI ID:6373004

A method of is disclosed improving electrical contact to a thin film of a p-type tellurium-containing II-VI semiconductor comprising: depositing a first undoped layer of ZnTe on a thin film of p-type tellurium containing II-VI semiconductor with material properties selected to limit the formation of potential barriers at the interface between the p-CdTe and the undoped layer, to a thickness sufficient to control diffusion of the metallic-doped ZnTe into the p-type tellurium-containing II-VI semiconductor, but thin enough to minimize affects of series resistance; depositing a second heavy doped p-type ZnTe layer to the first layer using an appropriate dopant; and depositing an appropriate metal onto the outer-most surface of the doped ZnTe layer for connecting an external electrical conductor to an ohmic contact. 11 figs.

Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC36-83CH10093
Assignee:
Midwest Research Inst., Kansas City, MO (United States)
Patent Number(s):
US 5909632; A
Application Number:
PPN: US 8-937720
OSTI ID:
6373004
Resource Relation:
Patent File Date: 25 Sep 1997
Country of Publication:
United States
Language:
English