Testing multilayer printed wiring board prepreg by differential-scanning calorimetry. Final report
Technical Report
·
OSTI ID:6340448
A simplified receiving inspection test for epoxy/glass prepreg was developed. This test, which could replace the resin flow test, uses differential scanning calorimetry to measure the glass transition temperature. The glass transition temperature was found to correlate well with the resin flow test.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6340448
- Report Number(s):
- BDX-613-2626; ON: DE81025607
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
PRINTED CIRCUITS
MATERIALS TESTING
CALORIMETRY
EPOXIDES
GLASS
LAYERS
RESINS
TRANSITION TEMPERATURE
ELECTRONIC CIRCUITS
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
POLYMERS
TESTING
THERMODYNAMIC PROPERTIES
420800* - Engineering- Electronic Circuits & Devices- (-1989)
PRINTED CIRCUITS
MATERIALS TESTING
CALORIMETRY
EPOXIDES
GLASS
LAYERS
RESINS
TRANSITION TEMPERATURE
ELECTRONIC CIRCUITS
ORGANIC COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
POLYMERS
TESTING
THERMODYNAMIC PROPERTIES
420800* - Engineering- Electronic Circuits & Devices- (-1989)