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Title: Fluxless soldering using activated acid vapors

Conference ·
OSTI ID:5982150

Acid vapors have been used to fluxlessly reduce metal oxides and enhance wetting of solder on metallizations. Dilute solutions of hydrogen, acetic acid and formic acid in an inert carrier gas of nitrogen or argon were used with the sessile drop technique for 60Sn-40 Pb solder on Cu and Au/Ni metallizations. The time to reduce metal oxides and the extent of wetting as a function of acid vapor concentrations were characterized. Acetic and formic acids reduce the surface metal oxides sufficiently to form metallurgically sound solder joints. Hydrogen did not reduce oxides rapidly enough at 220{degree}C to be suitable for soldering applications. The optimum conditions for oxide reduction with formic acid was with an acid vapor concentration in nitrogen carrier gas of 4% for Cu metallizations and 1.6% on Au/Ni. The acetic acid vapor concentration, also in nitrogen, was optimized at 1.5% for both metallizations. Above a vapor concentration of 1.5%, the acetic acid combined with the bare metal to form acetates which increased the wetting time. These results indicate that acid vapor fluxless soldering is a viable alternative to traditional flux soldering.

Research Organization:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
5982150
Report Number(s):
SAND-91-2743C; CONF-920247-4; ON: DE92005455
Resource Relation:
Conference: National electronics products conference (NEPCON) west, Anaheim, CA (United States), 23-27 Feb 1992
Country of Publication:
United States
Language:
English