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Title: Method and system for making integrated solid-state fire-sets and detonators

Abstract

A slapper detonator comprises a solid-state high-voltage capacitor, a low-jitter dielectric breakdown switch and trigger circuitry, a detonator transmission line, an exploding foil bridge, and a flier material. All these components are fabricated in a single solid-state device using thin film deposition techniques. 13 figs.

Inventors:
; ; ; ; ;
Publication Date:
Research Org.:
Univ. of California (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
597079
Patent Number(s):
US 5,731,538/A/
Application Number:
PAN: 8-816,952
Assignee:
Univ. of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 24 Mar 1998
Country of Publication:
United States
Language:
English
Subject:
45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEFENSE; DETONATORS; DESIGN; CAPACITORS; SWITCHING CIRCUITS; FABRICATION; THIN FILMS; DEPOSITION

Citation Formats

O`Brien, D W, Druce, R L, Johnson, G W, Vogtlin, G E, Barbee, Jr, T W, and Lee, R S. Method and system for making integrated solid-state fire-sets and detonators. United States: N. p., 1998. Web.
O`Brien, D W, Druce, R L, Johnson, G W, Vogtlin, G E, Barbee, Jr, T W, & Lee, R S. Method and system for making integrated solid-state fire-sets and detonators. United States.
O`Brien, D W, Druce, R L, Johnson, G W, Vogtlin, G E, Barbee, Jr, T W, and Lee, R S. 1998. "Method and system for making integrated solid-state fire-sets and detonators". United States.
@article{osti_597079,
title = {Method and system for making integrated solid-state fire-sets and detonators},
author = {O`Brien, D W and Druce, R L and Johnson, G W and Vogtlin, G E and Barbee, Jr, T W and Lee, R S},
abstractNote = {A slapper detonator comprises a solid-state high-voltage capacitor, a low-jitter dielectric breakdown switch and trigger circuitry, a detonator transmission line, an exploding foil bridge, and a flier material. All these components are fabricated in a single solid-state device using thin film deposition techniques. 13 figs.},
doi = {},
url = {https://www.osti.gov/biblio/597079}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 24 00:00:00 EST 1998},
month = {Tue Mar 24 00:00:00 EST 1998}
}