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Title: Dual-circuit embossed-sheet heat-transfer panel

Patent ·
OSTI ID:5955851

A heat transfer panel provides redundant cooling for fusion reactors or the like environment requiring low-mass construction. Redundant cooling is provided by two independent cooling circuits, each circuit consisting of a series of channels joined to inlet and outlet headers. The panel comprises a welded joinder of two full-size and two much smaller partial-size sheets. The first full-size sheet is embossed for form first portions of channels for the first and second circuits, as well as a header for the first circuit. The second full-sized sheet is then laid over and welded to the first full-size sheet. The first and second partial-size sheets are then overlaid on separate portions of the second full-sized sheet, and are welded thereto. The first and second partial-sized sheets are embossed to form inlet and outlet headers, which communicate with channels of the second circuit through apertures formed in the second full-sized sheet.

DOE Contract Number:
W-31-109-ENG-38
Assignee:
ERA-08-038246; NTS-83-015736; EDB-83-127447
Application Number:
ON: DE83013159
OSTI ID:
5955851
Country of Publication:
United States
Language:
English