Thermal conductance of pressed contacts at liquid helium temperatures
Abstract
The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation for the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.
- Authors:
- Publication Date:
- Research Org.:
- National Aeronautics and Space Administration, Moffett Field, CA (USA). Ames Research Center
- OSTI Identifier:
- 5718748
- Report Number(s):
- N-8327876; NASA-TM-84365
- Resource Type:
- Technical Report
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; ELECTRIC CONTACTS; THERMAL CONDUCTIVITY; COPPER; CRYOGENICS; ELECTRIC POTENTIAL; SUPERCONDUCTIVITY; TEMPERATURE DEPENDENCE; ULTRALOW TEMPERATURE; ELECTRIC CONDUCTIVITY; ELECTRICAL EQUIPMENT; ELECTRICAL PROPERTIES; ELEMENTS; EQUIPMENT; METALS; PHYSICAL PROPERTIES; THERMODYNAMIC PROPERTIES; TRANSITION ELEMENTS; 420201* - Engineering- Cryogenic Equipment & Devices
Citation Formats
Salerno, L J, Kittel, P, and Spivak, A L. Thermal conductance of pressed contacts at liquid helium temperatures. United States: N. p., 1983.
Web.
Salerno, L J, Kittel, P, & Spivak, A L. Thermal conductance of pressed contacts at liquid helium temperatures. United States.
Salerno, L J, Kittel, P, and Spivak, A L. 1983.
"Thermal conductance of pressed contacts at liquid helium temperatures". United States.
@article{osti_5718748,
title = {Thermal conductance of pressed contacts at liquid helium temperatures},
author = {Salerno, L J and Kittel, P and Spivak, A L},
abstractNote = {The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation for the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work.},
doi = {},
url = {https://www.osti.gov/biblio/5718748},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun May 01 00:00:00 EDT 1983},
month = {Sun May 01 00:00:00 EDT 1983}
}
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that may hold this item. Keep in mind that many technical reports are not cataloged in WorldCat.
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.