Cryogenic wafer prober for Josephson devices

Journal Article · Sun May 01 00:00:00 EDT 1983 · IEEE Trans. Magn.; (United States)

DOI:https://doi.org/10.1109/TMAG.1983.1062335· OSTI ID:5718576

Geary, J; Vella-Coleiro, G

A wafer probing system has been built for the testing of Josephson junction devices at helium temperature. A mechanism moves a probe card from one position to another on a two inch wafer while immersed in liquid helium. The mechanism is actuated by shafts which connect to stepper motors positioned above the helium dewar. A positioning accuracy of + or - 50 ..mu..m at the probe tips is achieved. The replaceable probe card is all ceramic and carries 120 rigidly mounted palladium-alloy needles, arranged in signal-ground pairs and positioned in an array which matches the pad design of the particular device under test. Controlled impedance transmission lines are maintained all the way to the wafer's surface. A computer interface is included so that probing of a whole wafer can be conducted under software control. The system is intended for routine testing of Josephson devices in wafer form as well as for testing very large numbers of individual junctions.

• Research Organization: Bell Laboratories, Murray Hill, NJ 07974
• OSTI ID: 5718576
• Journal Information: IEEE Trans. Magn.; (United States), Vol. 19:3
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
JOSEPHSON JUNCTIONS
PROBES
CERAMICS
COMPUTERIZED CONTROL SYSTEMS
DESIGN
ELECTRIC IMPEDANCE
PALLADIUM ALLOYS
PERFORMANCE TESTING
POSITIONING
TEMPERATURE CONTROL
ALLOYS
CONTROL
CONTROL SYSTEMS
IMPEDANCE
JUNCTIONS
PLATINUM METAL ALLOYS
SUPERCONDUCTING JUNCTIONS
TESTING
420201* - Engineering- Cryogenic Equipment & Devices