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Title: Solvent substitution for electronic products

Conference ·
OSTI ID:5705960

Allied-Signal Inc., Kansas City Division (KCD), manufactures the electrical, electrochemical, mechanical, and plastic components for nuclear weapons. The KCD has made a commitment to eliminate the use of chlorohydrocarbon (CHC) and chlorofluorocarbon (CFC) solvents to the greatest technical extent possible consistent with nuclear safety and stockpile reliability requirements. Current cleaning processes in the production departments use trichloroethylene, 1,1,1-trichloroethane, and various CFC-113 based solvents. Several non-halogenated solvents (Solvent A - an aqueous solvent based on N,N-dimethylacetamide, Solvent B - an aqueous mixture of ethanol amines, Solvent C - a hydrocarbon solvent based on octadecyl acetate, Solvent D - a terpene (d-limonene) hydrocarbon solvent combined with emulsifiers, Solvent E - a terpene (d-limonene) hydrocarbon solvent combined with a separation agent, d-limonene, and isopropyl alcohol) were evaluated to determine the most effective, non-chlorinated, non-fluorinated, alternate solvent cleaning system. All of these solvents were evaluated using current manual spray cleaning processes. The solvents were evaluated for their effectiveness in removing a rosin based RMA solder flux, a particular silicone mold release, and oils, greases, mold releases, resins, etc. The Meseran Surface Analyzer was used to measure organic contamination on the samples before and after cleaning. An Omega Meter Model 600 was also used to detect solder flux residues. Solvents C, D, E and d-limonene the best alternatives to trichloroethylene for removing all of the contaminants tested. For this particular electronic assembly, d-limonene was chosen as the alternate because of material compatibility and long-term reliability concerns.

Research Organization:
Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
Sponsoring Organization:
USDOE; USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-76DP00613
OSTI ID:
5705960
Report Number(s):
KCP-613-4787; CONF-920247-6; ON: DE92003225
Resource Relation:
Conference: National electronics products conference (NEPCON) west, Anaheim, CA (United States), 23-27 Feb 1992
Country of Publication:
United States
Language:
English