Technical grade hydrofluoric acid etch-back. Final report
Technical Report
·
OSTI ID:5644594
Technical grade hydrofluoric acid (TG HF) was compared with analytical reagent grade hydrofluoric acid (AG HF) in the epoxy-glass etch-back process cycle of multilayer printed wiring board (PWB) fabrication. AG HF was in short supply and TG HF was evaluated as a substitute. The two acids were compared for depth of etch-back, completeness of glass fiber removal, and surface topography. Results show that TG HF could be used as an alternate material in this process without any changes in operating parameters.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5644594
- Report Number(s):
- BDX-613-2701; ON: DE82004565
- Country of Publication:
- United States
- Language:
- English
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