Thermal contact electronic packaging in solar pointing space environment

Journal Article · Fri Feb 01 00:00:00 EST 1991 · Journal of Solar Energy Engineering; (USA)

OSTI ID:5637699

Colangelo, A M ^[1]; McKim, G S ^[2]

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1. Winfield Corp., San Diego, CA (US)
2. General Dynamics Corp., San Diego, CA (USA). Space Systems Div.

A thermal design for a solar pointing space shuttle mission is presented. The apparatus, which will measure solar flux intensity variations, contains sensors and data acquisition electronics which must be maintained within certain temperature constraints. The thermal design, which utilizes parallel heat flow paths and conduction fins to reject dissipated heat, is shown by finite difference thermal modeling to maintain component temperatures within these constraints. In the thermal modeling, arithmetic nodes are used to represent surface radiosity for radiation heat transfer. Also, the concept of mean fin conduction length and effective fin capacitance are introduced as means of simplifying the model representation of the conduction fins. An experiment was conducted to evaluate the chip/fin contact conductance.

• OSTI ID: 5637699
• Journal Information: Journal of Solar Energy Engineering; (USA), Vol. 113:1; ISSN 0199-6231
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
33 ADVANCED PROPULSION SYSTEMS
RADIANT HEAT TRANSFER
COMPUTERIZED SIMULATION
SOLAR FLUX
MEASURING INSTRUMENTS
TIME DEPENDENCE
SPACE SHUTTLES
DESIGN
CONDUCTOR DEVICES
DATA ACQUISITION SYSTEMS
ELECTRONIC EQUIPMENT
FINS
HEAT TRANSFER
MATHEMATICAL MODELS
TEMPERATURE CONTROL
THERMAL ANALYSIS
THERMAL CONDUCTIVITY
AIRCRAFT
CONTROL
ELECTRICAL EQUIPMENT
ENERGY TRANSFER
EQUIPMENT
PHYSICAL PROPERTIES
SIMULATION
SPACE VEHICLES
THERMODYNAMIC PROPERTIES
VEHICLES
140100* - Solar Energy- Resources & Availability
330000 - Advanced Propulsion Systems