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Title: Stress analysis of header material sets

Conference ·
OSTI ID:5613453

Header design ideology and material selection are described. Current header designs utilize a glass-ceramic insulator which is bonded to a current carrying pin and a metal shell. Residual stresses in the header occur as a result of cooling from the glass softening temperature and are attributable to differences within the header material set in coefficients of thermal expansion. A stress analysis is undertaken to model the residual thermal stresses in glass-ceramic headers. A feature of this model is that it simulates bonding at glass-ceramic to metal interfaces by precluding interfacial sliding. Residual stresses for four material sets are analyzed. These material sets are chosen to illustrate the various stress states which can arise due to differing combinations of coefficients of thermal expansion within a material set. 9 refs., 10 figs., 2 tabs.

Research Organization:
Monsanto Research Corp., Miamisburg, OH (USA). Mound
DOE Contract Number:
AC04-76DP00053
OSTI ID:
5613453
Report Number(s):
MLM-3477(OP); CONF-871234-9; ON: DE88004690
Resource Relation:
Conference: ASME winter meeting, Boston, MA, USA, 13 Dec 1987; Other Information: Paper copy only, copy does not permit microfiche production
Country of Publication:
United States
Language:
English