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Title: Layer growth in Au-Pb/In solder joints

Abstract

The solid state reaction between a Pb-In solder alloy and thin film Au has been investigated at ten aging temperatures ranging from 70 to 170/sup 0/C. Also, bulk Au-solder samples were aged at 150/sup 0/C for metallographic analysis. No significant difference was found between the aging behavior of thin and bulk Au specimens. A thin single phase layer of Au/sub 9/In/sub 4/ was found adjacent to Au while a thick two-phase layer of AuIn/sub 2/ and Pb was found between Au/sub 9/In/sub 4/ and solder. The Pb phase was shown to have considerable mobility and able to ripen at room temperature. Peculiar planar interface instabilities and voids in the Au-Au/sub 9/In/sub 4/ interface were found. The total layer thickness was found to vary linearly with aging time, indicating an interface-controlled reaction. An activation energy of 14,000 calories per mole was found by regression analysis of the kinetic data.

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (USA)
OSTI Identifier:
5501244
Report Number(s):
SLA-73-5963
ON: DE86013552
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Technical Report
Resource Relation:
Other Information: Paper copy only, copy does not permit microfiche production
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; GOLD; SOLDERING; INDIUM ALLOYS; LEAD ALLOYS; SOLDERED JOINTS; PHASE STUDIES; AGING; CHEMICAL REACTIONS; HIGH TEMPERATURE; INTERFACES; INTERMETALLIC COMPOUNDS; LAYERS; MEDIUM TEMPERATURE; MICROSTRUCTURE; TEMPERATURE DEPENDENCE; THICKNESS; VOIDS; ALLOYS; CRYSTAL STRUCTURE; DIMENSIONS; ELEMENTS; FABRICATION; JOINING; JOINTS; METALS; TRANSITION ELEMENTS; WELDING; 360101* - Metals & Alloys- Preparation & Fabrication

Citation Formats

Yost, F G, Ganyard, F P, and Karnowsky, M M. Layer growth in Au-Pb/In solder joints. United States: N. p., 1986. Web.
Yost, F G, Ganyard, F P, & Karnowsky, M M. Layer growth in Au-Pb/In solder joints. United States.
Yost, F G, Ganyard, F P, and Karnowsky, M M. 1986. "Layer growth in Au-Pb/In solder joints". United States.
@article{osti_5501244,
title = {Layer growth in Au-Pb/In solder joints},
author = {Yost, F G and Ganyard, F P and Karnowsky, M M},
abstractNote = {The solid state reaction between a Pb-In solder alloy and thin film Au has been investigated at ten aging temperatures ranging from 70 to 170/sup 0/C. Also, bulk Au-solder samples were aged at 150/sup 0/C for metallographic analysis. No significant difference was found between the aging behavior of thin and bulk Au specimens. A thin single phase layer of Au/sub 9/In/sub 4/ was found adjacent to Au while a thick two-phase layer of AuIn/sub 2/ and Pb was found between Au/sub 9/In/sub 4/ and solder. The Pb phase was shown to have considerable mobility and able to ripen at room temperature. Peculiar planar interface instabilities and voids in the Au-Au/sub 9/In/sub 4/ interface were found. The total layer thickness was found to vary linearly with aging time, indicating an interface-controlled reaction. An activation energy of 14,000 calories per mole was found by regression analysis of the kinetic data.},
doi = {},
url = {https://www.osti.gov/biblio/5501244}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1986},
month = {Wed Jan 01 00:00:00 EST 1986}
}

Technical Report:
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