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Title: A new family of copper-oxide-based isotropic metallic oxides for normal metal barriers in SNS junctions

Conference ·
OSTI ID:548466
 [1]
  1. Duke Univ., Durham, NC (United States). Dept. of Mechanical Engineering and Materials Science

Thin films and heterostructures of a new family of copper-oxide-based isotropic metallic oxides such as La{sub 6.4}Sr{sub 1.6}Cu{sub 8}O{sub 20}, La{sub 5}BaCu{sub 6}O{sub 13} and La{sub 6}BaYCu{sub 8}O{sub 20} have been investigated. These metallic oxides are oxygen deficient pseudo-cubic perovskites that exhibits Pauli paramagnetism, which could be ideal normal metals for SNS junctions in high {Tc} superconducting devices. The authors have grown epitaxial thin films of these metallic oxides and SNS superconducting heterostructures (c-axis YBa{sub 2}Cu{sub 3}O{sub 7}/La{sub 6.4}Sr{sub 1.6}Cu{sub 8}O{sub 20}/c-axis YBa{sub 2}Cu{sub 3}O{sub 7}) in situ by 90{degree} off-axis sputtering. X-ray diffraction and cross-sectional transmission electron microscopy reveal these heterostructures to have high crystalline quality and clean interfaces. This material will facilitate fabrication of ideal SNS Josephson junctions with low boundary resistance due to its excellent chemical compatibility and lattice match with cuprate superconductors and will be useful for determining the source of interface resistance in such heterostructures.

Sponsoring Organization:
Office of Naval Research, Washington, DC (United States); National Science Foundation, Washington, DC (United States)
OSTI ID:
548466
Report Number(s):
CONF-960163-; ISBN 0-8194-2071-9; TRN: 98:000281
Resource Relation:
Conference: Photonics West `96: conference on quantum well and superlattice physics VI, San Jose, CA (United States), 27 Jan - 2 Feb 1996; Other Information: PBD: 1996; Related Information: Is Part Of Oxide superconductor physics and nano-engineering II; Bozovic, I. [ed.] [Varian Research Center, Palo Alto, CA (United States)]; Pavuna, D. [ed.] [Swiss Federal Inst. of Tech., Lausanne (Switzerland)]; PB: 578 p.; Proceedings/SPIE, Volume 2697
Country of Publication:
United States
Language:
English