Thin films
- International Business Machines Corp., San Jose, CA (United States)
- Oak Ridge National Lab., TN (United States)
- Rice Univ., Houston, TX (United States)
This volume is a compilation of papers presented at the 1990 Spring Meeting of the Materials Research Society in a symposium entitled Thin Films: Stresses and Mechanical Properties II. As indicated by the title, the symposium was the second in a series, the first of which was held at the Fall Meeting in 1988. The importance of thin film mechanical properties is now recognized to the extent that basic characterization techniques such as microindentation and thin film stress measurement are performed routinely, and new characterization techniques are being developed on a daily basis. Many of the papers in the symposium dealt with the developments in these characterization methods and their application to a broad spectrum of materials such as compositionally modulated structures, ion implanted materials, optical coatings, and the numerous metals, ceramics and organics used in semiconductor device manufacture.
- OSTI ID:
- 5426398
- Report Number(s):
- CONF-900466-; ISBN: 1-55899-077-1
- Resource Relation:
- Conference: Spring meeting of the Materials Research Society (MRS), San Francisco, CA (United States), 16-21 Apr 1990
- Country of Publication:
- United States
- Language:
- English
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74 ATOMIC AND MOLECULAR PHYSICS
37 INORGANIC
ORGANIC
PHYSICAL AND ANALYTICAL CHEMISTRY
INTERFACES
FINE STRUCTURE
MEETINGS
STRESS ANALYSIS
THIN FILMS
CATHODOLUMINESCENCE
MATERIALS TESTING
MICROHARDNESS
YOUNG MODULUS
ADHESION
CERAMICS
CHEMICAL REACTION KINETICS
COMPOSITE MATERIALS
ELECTRON MICROPROBE ANALYSIS
FRACTURE MECHANICS
LEADING ABSTRACT
SEMICONDUCTOR MATERIALS
STRESS RELAXATION
ABSTRACTS
CHEMICAL ANALYSIS
DOCUMENT TYPES
FILMS
HARDNESS
KINETICS
LUMINESCENCE
MATERIALS
MECHANICAL PROPERTIES
MECHANICS
MICROANALYSIS
NONDESTRUCTIVE ANALYSIS
REACTION KINETICS
RELAXATION
TESTING
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