Improved di-p-xylylene polymer and apparatus and method for making the same
Patent
·
OSTI ID:5383265
Solid di-para-xylyene dimer is sublimed in a sublimation furnace at approximately 100 to 200/sup 0/C and subsequently conducted to a pyrolysis furnace where it is pyrolyzed to the diradical p-xylylene monomer while in the vapor state at approximately 600 degrees C. The diradical monomer is then introduced into a deposition chamber for deposition onto a suitable substrate. The deposition chamber includes electrodes for producing a low pressure plasma through which the diradical monomer passes prior to deposition. The interaction of the diradical monomer with the low pressure plasma results in the formation of poly-p-xylyene film which is exceptionally hard and thermally stable.
- DOE Contract Number:
- W-7405-ENG-36
- Assignee:
- EDB-84-036715
- Application Number:
- ON: DE84006193
- OSTI ID:
- 5383265
- Country of Publication:
- United States
- Language:
- English
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