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Title: Deformation and fracture characteristics of Inconel X-750 at room temperature and elevated temperatures

Journal Article · · Metall. Trans., A; (United States)
DOI:https://doi.org/10.1007/BF02654718· OSTI ID:5348983

Electron fractographic and thin foil electron metallographic techniques were used to evaluate the deformation and fracture characteristics of Inconel X-750 at temperatures ranging from 24 to 816/sup 0/C. Operative dislocation mechanisms and fracture surface morphologies were related to the overall tensile response of this nickel-base superalloy. At room temperature, failure occurred primarily by an intergranular dimple rupture mechanism associated with microvoid coalescence along grain boundary denuded regions. A fairly high density of dislocations throughout the matrix resulted in relatively high ductility levels even though failure occurred by an intergranular mechanism. Under intermediate temperature conditions (316 to 427/sup 0/C), increased transgranular fracture coupled with extensive dislocation activity within the Inconel X-750 matrix caused a slight increase in ductility. At progressively higher temperatures, 538 to 704/sup 0/C, all dislocation activity was channeled through narrow slip bands which subsequently initiated localized separation and resulted in a very faceted fracture surface appearance. The absence of a homogeneous dislocation substructure in this temperature regime resulted in a severe degradation in ductility levels. At the highest test temperature (816/sup 0/C), a uniform dislocation network throughout the Inconel X-750 matrix coupled with intense dislocation activity in the grain boundary denuded zone resulted in a marked improvement in ductility. Furthermore, the extensive dislocation activity along grain boundary regions ultimately resulted in an intergranular fracture morphology.

Research Organization:
Hanford Engineering Development Lab., Richland, WA
DOE Contract Number:
DE-AC14-76FFO2170
OSTI ID:
5348983
Journal Information:
Metall. Trans., A; (United States), Vol. 11:6
Country of Publication:
United States
Language:
English