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Title: Microelectronic superconducting crossover and coil

Patent ·
OSTI ID:5172018

A microelectronic component comprising a crossover is provided comprising a substrate, a first high T[sub c] superconductor thin film, a second insulating thin film comprising SrTiO[sub 3]; and a third high T[sub c] superconducting film which has strips which crossover one or more areas of the first superconductor film. An in situ method for depositing all three films on a substrate is provided which does not require annealing steps and which can be opened to the atmosphere between depositions. 13 figures.

DOE Contract Number:
AC03-76SF00098
Assignee:
Univ. of California, Oakland, CA ()
Patent Number(s):
US 5291035; A
Application Number:
PPN: US 8-033059
OSTI ID:
5172018
Resource Relation:
Patent File Date: 10 Mar 1993
Country of Publication:
United States
Language:
English