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Title: Silicon-on-insulator materials and devices

Conference · · Transactions of the American Nuclear Society; (USA)
OSTI ID:5168487

Silicon-on-insulator (SOI) has emerged during the past several years as the most promising approach to satisfying the increasingly demanding requirements for integrated circuits tolerant to total-dose X rays as well as to transient radiation pulses and high-energy particles. The basic mechanisms of radiation damage and circuit performance implications in SOI are similar in some respects to the effects in other integrated circuit technologies; however, there are several unique effects and device-related consequences that are available due to the thin silicon layers and buried oxide insulator used in the SOI device structure. The basic features of SOI materials and their fabrication, as well as the unique areas where radiation effects in SOI devices differ from those in devices produced on bulk silicon. The fabrication requirements for materials for complementary metal-oxide semiconductors (CMOS) and bipolar SOI devices are considered in this paper as well as the relationship between material fabrication and device requirements.

OSTI ID:
5168487
Report Number(s):
CONF-890604-; CODEN: TANSA; TRN: 90-002914
Journal Information:
Transactions of the American Nuclear Society; (USA), Vol. 59; Conference: Annual meeting of the American Nuclear Society, Atlanta, GA (USA), 4-8 Jun 1989; ISSN 0003-018X
Country of Publication:
United States
Language:
English