An electrical network analogous technique for measuring thermophysical properties of conductive materials
In this novel measurement technique, a sample of conducting continuous material is modeled as an electrical network. The electrical resistance of the sample is measured between several selected locations on its surface, which are reflected in the network model as outer leads. The model yields a set of non-linear algebraic equations in which the right hand side corresponds to an experimental external measurement of resistance. The solution of the system yields a mapping of the electrical resistance throughout the material sample. A carefully controlled calibration process identifies the dependence of electrical resistance on temperature for the specific material sample. The sample is then subjected to heating or cooling to generate a non-uniform temperature distribution within it. The electrical resistance is then measured as a function of time, and in steady state. The solution of the network equations provides a spatial mapping of the electrical resistance and thus the temperature of the sample, both as a function of time, and in steady state. These measurements provide enough information to evaluate the thermal conductivity of the material sample as a function of space and temperature. The technique is particularly suited for composite non-isotropic materials, material samples of irregular shape, and materials for high temperatures applications, where such measurements are otherwise very difficult. A selected exploratory experiment and the corresponding calculations are presented to demonstrate the technique's feasibility and accuracy. 1 ref., 8 figs.
- Research Organization:
- EG and G Idaho, Inc., Idaho Falls, ID (United States)
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC07-76ID01570
- OSTI ID:
- 5055801
- Report Number(s):
- EGG-M-90257; CONF-900971-3; ON: DE91018714
- Resource Relation:
- Conference: 12. European conference on thermophysical properties: ECTP-12, Vienna (Austria), 24-28 Sep 1990
- Country of Publication:
- United States
- Language:
- English
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