Calorimetric measurements of the effect of nickel and stabrite coatings and resistive cores on AC loss in accelerator cables under fixed pressure
- Ohio State Univ., Columbus, OH (United States)
- Lawrence Berkeley Lab., CA (United States); and others
Calorimetric measurements of AC loss on long three- and four-layer stacks of Rutherford cable have been made with the applied field both normal to (face-on, FO, orientation) and parallel to the plane of the cable. Cables studied had bare-Cu, Ni-plated, and stabrite-coated strands; the latter were provided with metallic or insulating interlayers (cores) of, respectively, unalloyed Ti, stainless steel, and kapton ribbon. The cable packs were clamped in a fixture to a pressure of 75 MPa and heat treated for several hours at temperatures of 185 to 250{degrees}C. After cooling, the clamped cables were transferred to the calorimeter and measured without releasing the pressure. From the field-ramp-rate dependence of coupling loss the interlayer and intralayer interstrand contact resistances, R{sub {perpendicular}} and R{sub {parallel}} were deduced. The results were interpreted against a background of earlier {open_quotes}cure-release-repressurize{close_quotes} calorimetric measurements of cable loss as well as direct measurements of contact resistance. Depending on the curing temperature the bare-Cu cable exhibited the highest (T{sub cure} = 250{degrees}C) and the lowest (T{sub cure} = 185{degrees}C) FO losses. Nickel plating resulted in a cable that was much less sensitive to curing temperature. All the core-type cables (T{sub cure} = 185 and 200{degrees}C) exhibited FO loss that was mid-way between those of bare Cu (T{sub cure} = 185{degrees}C) and Ni-plated (T{sub cure} = 200{degrees}C) cables.
- DOE Contract Number:
- FG02-95ER40900
- OSTI ID:
- 483602
- Report Number(s):
- CONF-950722-; ISSN 0065-2482; TRN: 97:010624
- Journal Information:
- Advances in Cryogenic Engineering, Vol. 42B; Conference: CEC/ICMC `95: cryogenic engineering conference and international cryogenic materials conference, Columbus, OH (United States), 17-21 Jul 1995; Other Information: PBD: 1997
- Country of Publication:
- United States
- Language:
- English
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