Predicted ball grid array thermal response during reflow soldering
Book
·
OSTI ID:462610
- Univ. of Texas, Austin, TX (United States). Dept. of Mechanical Engineering
A numerical model is developed to predict the detailed thermomechanical response of a BGA assembly during reflow soldering. The governing coupled solid mechanics and heat diffusion equations are solved using a commercially available finite element package. Reported predictions illustrate the system`s sensitivity to both thermal and mechanical processing conditions, as well as component thermal properties. Specifically, assemblies with components of high thermal conductivity show the greatest sensitivity to mechanical loading conditions.
- OSTI ID:
- 462610
- Report Number(s):
- CONF-950828-; ISBN 0-7918-1705-9; TRN: IM9719%%80
- Resource Relation:
- Conference: 1995 National heat transfer conference, Portland, OR (United States), 5-9 Aug 1995; Other Information: PBD: 1995; Related Information: Is Part Of 1995 national heat transfer conference: Proceedings. Volume 4: Transport phenomena in manufacturing and materials processing; Transport phenomena in materials joining processes; Transport phenomena in net shape manufacturing; HTD-Volume 306; Mahajan, R.L. [ed.] [Univ. of Colorado, Boulder, CO (United States)]; PB: 261 p.
- Country of Publication:
- United States
- Language:
- English
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