Thermal characteristics of two phase thermosyphon cooling module for multi-chip device

Conference · Tue Dec 31 00:00:00 EST 1996

OSTI ID:445450

Choi, S B ^[1]; Nam, S S ^[2]; Kim, J H; Kwak, H Y ^[3]

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1. Korea Aerospace Research Inst., Taejon (Korea, Republic of)
2. Electronics and Telecommunication Research Inst., Taejon (Korea, Republic of)
3. Chung-Ang Univ., Seoul (Korea, Republic of). Mechanical Engineering Dept.

A thermosyphonic cooling module (TSCM) has been designed, fabricated and tested to cool the multi-chip plugged into a planar packaging system. The cooling module consists of a cold plate and an integrated condenser. With an allowable temperature rise of 56 C on the surface of the heater, the cooling module TSCM can handle a heat flux about 2.7 W/cm{sup 2}. The transient characteristics of the cooling module have proved to be excellent; that is, when a heat load is applied to the system, steady state can be achieved within 10--15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser and ambient as well as the condenser temperatures affect the system performance.

• OSTI ID: 445450
• Report Number(s): CONF-961105-; ISBN 0-7918-1543-9; TRN: IM9713%%186
• Resource Relation: Conference: 1996 international mechanical engineering congress and exhibition, Atlanta, GA (United States), 17-22 Nov 1996; Other Information: PBD: 1996; Related Information: Is Part Of Advances in energy efficiency, heat/mass transfer enhancement. PID-Volume 2; HTD-Volume 338; Ohadi, M.M.; Dessiatoun, S.V. [eds.] [Univ. of Maryland, College Park, MD (United States)]; Shekarriz, A.R. [ed.] [Pacific Northwest Lab., Richland, WA (United States)]; PB: 70 p.
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES
ELECTRONIC EQUIPMENT
COOLING SYSTEMS
THERMOSYPHONS
TWO-PHASE FLOW
PERFORMANCE
HEAT TRANSFER
DESIGN
OPERATION