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Title: Ceramic bearing development. Volume 3. Development of a thermal proof test for silicon nitride balls. Interim report, 1 August 1992-1 October 1994

Technical Report ·
OSTI ID:442287

The Major objective of the Development of a Thermal Proof Test for Silicon Nitride Balls was to improve hybrid bearing reliability by the elimination of critical size flaws that cause early failures. The two main tasks in this effort were the demonstration of a thermal proof test method, and the fatigue life testing of thermal proof tested balls. A thermal proof test based on fracture mechanics was developed. A Weibull Relationship was observed between thermal quench temperature deltaT, and the probability of crack extension. Three hundred 7/16 in. NBD-200 balls were thermal proof tested and optically inspected. 224 of these, judged `acceptable`, were tested in hybrid bearings, at 2.9 Mpa (420 KSI) contract stress. Post-mortem analysis of failures in the hybrid bearing tests indicated that proof testing may have promoted failures in balls that, although flawed, may have otherwise performed satisfactorily. Thermal proof testing may be more useful as a sample inspection for lot qualification and process improvement studies, rather than for inspection of balls to be used in critical applications.

Research Organization:
Cerbec, Inc., East Granby, CT (United States)
OSTI ID:
442287
Report Number(s):
AD-A-317564/3/XAB; CNN: Contract F33615-92-C-5917; TRN: 70340175
Resource Relation:
Other Information: PBD: Mar 1995
Country of Publication:
United States
Language:
English