Degradation mechanisms and stability forecasting and adhesion contacts of metal films with binary dielectric substrates
- Israel Inst. of Technology, Haifa (Israel)
- Latvian Univ., Riga (Latvia)
In this paper the authors present their conception of degradation and stability on the adhesion contacts of metal films with binary nonmetallic crystals. There are numerous works devoted to the atomic scale determination of adhesion forces and development of adhesion interaction laws. But in the real life the kinetic processes, taking place on the adhesion contact, can lead to such dramatic changes in adhesion strength values that the initial adhesion characteristics do not worth much for practice. Sometimes, adhesion contact with a metal which supposed to be highly adhesive failes in a short period of aging time. What the authors have learned from their studies of the contact processes is that in many cases the aging could not be separately addressed to the individual properties of film metal or to those of the substrate material. It depends mainly on the relationships between the parameters of interacting pair. The question is: what parameters should be taken into account to explain degradation phenomena and to predict them? The purpose of the present work is to show how the relative chemical activity of film metal and substrate cation affects the contact degradation in a vacuum and in different environmental conditions.
- OSTI ID:
- 441499
- Report Number(s):
- CONF-960214-; TRN: 96:006556-0032
- Resource Relation:
- Conference: 19. annual meeting of the Adhesion Society, Inc, Myrtle Beach, SC (United States), 18-21 Feb 1996; Other Information: PBD: 1996; Related Information: Is Part Of Proceedings of the 19th annual meeting of the Adhesion Society; Ward, T.C. [ed.]; PB: 567 p.
- Country of Publication:
- United States
- Language:
- English
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