Integrated thermal analysis of natural convection air cooled electronic enclosure
- Univ. of Maryland, College Park, MD (United States). CALCE Electronic Packaging Research Center
Traditional thermal analyses of electronic equipment are based on conduction type solvers at the printed wiring board (PWB) level. These require specifications of convection coefficients on the board and component surfaces, which are in most realistic applications unknown. In recent years, with the advancement in computational fluid dynamics (CFD)/computational heat transfer (CHT) tools, system level simulations have been undertaken to evaluate thermal performance of electronic equipment. Due to the large computational time and storage requirements involved in such simulations, the grid sizes in these are usually not fine enough to obtain adequate details at the board and component levels. In order to accurately predict thermal performance of the complete electronic system, all levels of modeling must be performed in an integrated and efficient manner. In the present paper, a methodology is described for the integrated thermal analysis of a laminar natural convection air cooled electronic system. This approach is illustrated by modeling an enclosure with electronic components of different sizes mounted on a printed wiring board. First, a global model for the entire enclosure was developed using a CFD/CHT approach on a coarse grid. The solution to the global model was obtained using a finite volume method. Thermal information from the global model, in the form of board and component surface temperatures, local heat transfer coefficients and reference temperatures, and heat fluxes, was extracted. These quantities were interpolated on a finer grid using Lagrangian polynomials and further employed in board and component level thermal analyses as various boundary conditions.
- OSTI ID:
- 423101
- Report Number(s):
- CONF-960815-; ISBN 0-7918-1511-0; TRN: IM9707%%408
- Resource Relation:
- Conference: 31. national heat transfer conference, Houston, TX (United States), 3-6 Aug 1996; Other Information: PBD: 1996; Related Information: Is Part Of ASME proceedings of the 31. national heat transfer conference: Volume 7. HTD-Volume 329; Schmidt, R.; Anderson, A.; Mulay, S.; Kim, S.; Lee, S.; Price, D.C.; Kendall, M.; Frank, L.E.; Saums, D.L. [eds.]; PB: 261 p.
- Country of Publication:
- United States
- Language:
- English
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