Cooling of electronics by heat pipes and thermosyphons -- A review of methods and possibilities
Conference
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OSTI ID:423093
- Kungliga Tekniska Hoegskolan, Stockholm (Sweden)
In this paper, passive techniques for cooling of electronic components by boiling and condensation are reviewed. Heat pipes, thermosyphon pipes, as well as simple and advanced thermosyphon loops are treated. Performance limitations for each type are discussed, as well as benefits and disadvantages with immersion boiling compared to indirect cooling. Numerous examples of designs from the literature are shown and their performance characteristics are cited.
- OSTI ID:
- 423093
- Report Number(s):
- CONF-960815-; ISBN 0-7918-1511-0; TRN: IM9707%%400
- Resource Relation:
- Conference: 31. national heat transfer conference, Houston, TX (United States), 3-6 Aug 1996; Other Information: PBD: 1996; Related Information: Is Part Of ASME proceedings of the 31. national heat transfer conference: Volume 7. HTD-Volume 329; Schmidt, R.; Anderson, A.; Mulay, S.; Kim, S.; Lee, S.; Price, D.C.; Kendall, M.; Frank, L.E.; Saums, D.L. [eds.]; PB: 261 p.
- Country of Publication:
- United States
- Language:
- English
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· AIP Conference Proceedings
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OSTI ID:423093