Low dielectric constant fibers from a fluorinated polymide for electronic packaging
- Naval Research Lab., Washington, DC (United States)
- NASA Langley Research Center, Hampton, VA (United States)
As the electronics industry moves toward higher frequencies, the need for laminate materials with enhanced dielectric properties is crucial. Since uniaxial composites are highly filled with reinforcing materials, fibers will play a significant role in lowering the overall dielectric constant of multi-layer printed wiring boards. Past fibers from a low dielectric constant ({epsilon}{prime} = 2.5) polyimide made from 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 2,2-bis [4-(4-aminophenoxy) phenyl] hexafluoropropane (4BDAF) were wet-spun into an ethyl alcohol/water bath using a dimethylacetamide (DMAc)/Polymer solution. Relatively weak filaments ({Epsilon}{prime} = 5.1 GPa) result from processing with DMAc, as the fiber core is very porous. A new spinning method, using controlled miscibility between the solvent and the coagulant, yielded solid core fibers using methylene chloride as the solvent. These 6FDA-4BDAF fibers have textile-like mechanical properties having; a modulus of 7-8 GPa, a tensile strength of 300-380 MPa, and a break strain of 4-7%.
- OSTI ID:
- 370890
- Report Number(s):
- CONF-960376-; TRN: 96:003805-0952
- Resource Relation:
- Conference: Spring national meeting of the American Chemical Society (ACS), New Orleans, LA (United States), 24-28 Mar 1996; Other Information: PBD: 1996; Related Information: Is Part Of 211th ACS national meeting; PB: 2284 p.
- Country of Publication:
- United States
- Language:
- English
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