UV-photoassisted etching of GaN in KOH
Journal Article
·
· Journal of Electronic Materials
- Univ. of Florida, Gainesville, FL (United States)
- Hanyang Univ., Seoul (Korea, Republic of). Dept. of Ceramic Engineering
- Sandia National Labs., Albuquerque, NM (United States)
The etch rate of GaN under ultraviolet-assisted photoelectrochemical conditions in KOH solutions is found to be a strong function of illumination intensity, solution molarity, sample bias, and material doping level. At low e-h pair generation rates, grain boundaries are selectively etched, while at higher illumination intensities etch rates for unintentionally doped (n {approximately} 3 {times} 10{sup 16} cm{sup {minus}3}) GaN are {ge} 1,000 {angstrom} {center_dot} min{sup {minus}1}. The etching is diffusion-limited under the conditions with an activation energy of {approximately} 0.8 kCal{center_dot}mol{sup {minus}1}. The etched surfaces are rough, but retain their stoichiometry.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- Defense Advanced Research Projects Agency, Arlington, VA (United States); Electric Power Research Inst., Palo Alto, CA (United States); USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 345075
- Report Number(s):
- CONF-9806176-; ISSN 0361-5235; TRN: IM9922%%8
- Journal Information:
- Journal of Electronic Materials, Vol. 28, Issue 3; Conference: 40. electronic materials conference, Charlottesville, VA (United States), 24 Jun 1998; Other Information: PBD: Mar 1999
- Country of Publication:
- United States
- Language:
- English
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