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Title: Materials processing with atmospheric-pressure plasma jets

Conference ·
OSTI ID:343589
; ; ;  [1]; ; ; ;  [2]
  1. Univ. of California, Los Angeles, CA (United States). Chemical Engineering Dept.
  2. Los Alamos National Lab., NM (United States). Plasma Physics Div.

Atmospheric-pressure plasma jets can be used for a wide range of materials processing applications, including surface cleaning and modification, selective etching, and thin-film deposition. The plasma source consists of two closely spaced electrodes through which helium and other gases flow (O{sub 2}, CF{sub 4}, etc.). A variety of electrode configurations can be used, and the source is suitable for continuous and large-area processing of materials. Another advantage of the plasma jet is that it achieves etching and deposition rates that are higher than those obtained in low-pressure plasmas. At the meeting, the plasma source will be described in detail, and results for several materials processing applications will be presented.

OSTI ID:
343589
Report Number(s):
CONF-980601-; TRN: IM9921%%52
Resource Relation:
Conference: 25. international conference on plasma science, Raleigh, NC (United States), 1-4 Jun 1998; Other Information: PBD: 1998; Related Information: Is Part Of IEEE conference record -- Abstracts. 1998 IEEE international conference on plasma science; PB: 343 p.
Country of Publication:
United States
Language:
English