Polyimide films from vapor deposition: Toward high strength, NIF capsules
- Lawrence Livermore National Lab., CA (United States)
The focus of recent efforts at LLNL has been to demonstrate that vapor deposition processing is a suitable technique to form polyimide films with sufficient strength for current National Ignition Facility target specifications. Production of polyimide films with controlled stoichiometry was accomplished by: (1) depositing a novel co-functional monomer and (2) matching the vapor pressure of each monomer in PMDA/ODA co-depositions. The sublimation and deposition rate for the monomers was determined over a range of temperatures. Polyimide films with thicknesses up to 30 {micro}m were fabricated. Composition, structure and strength were assessed using FTIR, SEM and biaxial burst testing. The best films had a tensile strength of approximately 100 MPa. A qualitative relationship between the stoichiometry and tensile strength of the film was demonstrated. Thin films ({approximately}3.5 {micro}m) were typically smooth with an rms of 1.5 nm.
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 328361
- Journal Information:
- Fusion Technology, Vol. 35, Issue 2; Other Information: PBD: Mar 1999
- Country of Publication:
- United States
- Language:
- English
Similar Records
MODELING POLYMER VAPOR DEPOSITION: PMDA-ODA POLY(AMIC ACID)
Effects of mechanical properties of metal films on the adhesion strength of Cr/polyimide interfaces