Electroless copper plating
Patent
·
OSTI ID:321167
An optimized electroless copper plating technique is described suitable for plating electroless copper upon ceramics. 12 figs.
- Research Organization:
- Honeywell International Inc
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- Assignee:
- AlliedSignal Inc., Morristown, NJ (United States)
- Patent Number(s):
- US 5,849,355/A/
- Application Number:
- PAN: 8-717,195
- OSTI ID:
- 321167
- Resource Relation:
- Other Information: PBD: 15 Dec 1998
- Country of Publication:
- United States
- Language:
- English
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