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Title: Creep-fatigue interactions in eutectic tin-lead-based solder alloys. Ph.D. Thesis

Thesis/Dissertation ·
OSTI ID:236774

Eutectic tin-lead solder alloys subjected to cyclic loading at room temperature experience creep-fatigue interactions due to high homologous temperature. At temperature above 0.5 melting point, the dominant damage mechanism can be cavity nucleation and growth, especially for alloys that have fine grain structure and a large volume fraction of dispersoids. The objective of the present study is to model the damage evolution during creep-fatigue interactions and experimentally validate the damage evolution based life predictions in rapidly solidified solder alloys. Four types of solder alloys were considered in this research, namely, conventional 63Sn-37Pb, rapidly solidified 63Sn-37Pb, dispersion-strengthened eutectic solders, and solid solution strengthened eutectic solders. Mechanical properties of the solder alloys and the life times under creep-fatigue conditions were evaluated. Damage produced in the course of creep or fatigue deformation was studied by metallography, scanning electron microscopy, precision density measurement, and the observation of grain boundary sliding. Based on the damage characteristics, the dominant failure mechanism was proved to be cavity growth. Three cavity growth models were applied to four types of solder alloys to predict creep-fatigue life by taking into account the tensile loading component as well as the compressive loading component when reversed process can occur. An algorithm to calculate cavity growth in each fatigue cycle is used to predict the number of fatigue cycles to failure, where failure is defined as a critical cavity size. Calculated lives are compared to experimental data under six types of creep-fatigue loading histories. The method predicts the creep-fatigue lives within a factor of two with the incorporation of appropriate compressive healing factor. Discrepancy between calculated lives and experimental results is discussed.

Research Organization:
Washington Univ., St. Louis, MO (United States)
OSTI ID:
236774
Report Number(s):
N-96-21510; NIPS-96-33345; TRN: 9621510
Resource Relation:
Other Information: TH: Ph.D. Thesis; PBD: Jan 1994
Country of Publication:
United States
Language:
English

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