Design of smart 3D-digital X-ray microtomographic scanners for non-destructive testing of materials and components of electronic devices with a multilayered structure

Journal Article · Tue Oct 27 00:00:00 EDT 2015 · AIP Conference Proceedings

DOI:https://doi.org/10.1063/1.4932917· OSTI ID:22492594

Syryamkin, V. I., E-mail: [e-mail]; Klestov, S. A., E-mail: [e-mail]; Echina, E. S., E-mail: [e-mail] ^[1]; Suntsov, S. B., E-mail: [e-mail] ^[1]; Academician M.F. Reshetnev Information Satellite Systems, Zheleznogorsk, Krasnoyarsk region, 662972 ^[2]

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1. National Research Tomsk State University, Tomsk, 634050 (Russian Federation)
2. (Russian Federation)

The article studies the operating procedures of an X-ray microtomographic scanner and the module of reconstruction and analysis 3D-image of a test sample in particular. An algorithm for 3D-image reconstruction based on image shadow projections and mathematical methods of the processing are described. Chapter 1 describes the basic principles of X-ray tomography and general procedures of the device developed. Chapters 2 and 3 are devoted to the problem of resources saving by the system during the X-ray tomography procedure, which is achieved by preprocessing of the initial shadow projections. Preprocessing includes background noise removing from the images, which reduces the amount of shadow projections in general and increases the efficiency of the group shadow projections compression. Chapter 4 covers general procedures of defect search, which is based on vector analysis principles. In conclusion, the main applications of X-ray tomography are presented.

• OSTI ID: 22492594
• Journal Information: AIP Conference Proceedings, Vol. 1683, Issue 1; Conference: International conference on advanced materials with hierarchical structure for new technologies and reliable structures 2015, Tomsk (Russian Federation), 21-25 Sep 2015; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0094-243X
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ALGORITHMS
BACKGROUND NOISE
COMPRESSION
DEFECTS
DESIGN
ELECTRONIC EQUIPMENT
IMAGE PROCESSING
IMAGES
LAYERS
NONDESTRUCTIVE TESTING
THREE-DIMENSIONAL CALCULATIONS
TOMOGRAPHY
VECTORS
X RADIATION