Effect of intermetallic compounds on the thermal conductivity of Ti-Cu composites
Abstract
Ti films were deposited by magnetron sputtering on polycrystalline Cu substrates. The samples were annealed at different temperatures and characterized by x-ray diffraction for phase identification, scanning electron microscopy, and energy dispersive spectrometry for microstructure and composition and transient thermoreflectance for thermal conductivity and interface thermal conductance. The results showed that the diffused layer of Ti in Cu contained intermetallic compounds and solid solution of Ti in Cu. The thermal conductivity of the diffused layer is reduced, and the thickness increased for higher annealing temperature. The interface thermal conductance also decreased for higher temperature of annealing. A stable Cu{sub 4}Ti phase was formed after annealing at 725 °C with thermal conductivity of 10 W m{sup −1} K{sup −1}. The interface thermal conductance between the intermetallic compound and the solid solution of Ti in Cu also was reduced to 30 MW m{sup −2} K{sup −1}. The effective thermal resistance of the diffused layer and the interface was found to increase for higher annealing temperature.
- Authors:
- Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695 (United States)
- Publication Date:
- OSTI Identifier:
- 22489791
- Resource Type:
- Journal Article
- Journal Name:
- Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films
- Additional Journal Information:
- Journal Volume: 34; Journal Issue: 2; Other Information: (c) 2016 American Vacuum Society; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0734-2101
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; ANNEALING; INTERFACES; INTERMETALLIC COMPOUNDS; MAGNETRONS; MICROSTRUCTURE; POLYCRYSTALS; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; SPECTROSCOPY; THERMAL CONDUCTIVITY; X-RAY DIFFRACTION
Citation Formats
Jagannadham, K., E-mail: jag-kasichainula@ncsu.edu. Effect of intermetallic compounds on the thermal conductivity of Ti-Cu composites. United States: N. p., 2016.
Web. doi:10.1116/1.4939142.
Jagannadham, K., E-mail: jag-kasichainula@ncsu.edu. Effect of intermetallic compounds on the thermal conductivity of Ti-Cu composites. United States. https://doi.org/10.1116/1.4939142
Jagannadham, K., E-mail: jag-kasichainula@ncsu.edu. 2016.
"Effect of intermetallic compounds on the thermal conductivity of Ti-Cu composites". United States. https://doi.org/10.1116/1.4939142.
@article{osti_22489791,
title = {Effect of intermetallic compounds on the thermal conductivity of Ti-Cu composites},
author = {Jagannadham, K., E-mail: jag-kasichainula@ncsu.edu},
abstractNote = {Ti films were deposited by magnetron sputtering on polycrystalline Cu substrates. The samples were annealed at different temperatures and characterized by x-ray diffraction for phase identification, scanning electron microscopy, and energy dispersive spectrometry for microstructure and composition and transient thermoreflectance for thermal conductivity and interface thermal conductance. The results showed that the diffused layer of Ti in Cu contained intermetallic compounds and solid solution of Ti in Cu. The thermal conductivity of the diffused layer is reduced, and the thickness increased for higher annealing temperature. The interface thermal conductance also decreased for higher temperature of annealing. A stable Cu{sub 4}Ti phase was formed after annealing at 725 °C with thermal conductivity of 10 W m{sup −1} K{sup −1}. The interface thermal conductance between the intermetallic compound and the solid solution of Ti in Cu also was reduced to 30 MW m{sup −2} K{sup −1}. The effective thermal resistance of the diffused layer and the interface was found to increase for higher annealing temperature.},
doi = {10.1116/1.4939142},
url = {https://www.osti.gov/biblio/22489791},
journal = {Journal of Vacuum Science and Technology. A, Vacuum, Surfaces and Films},
issn = {0734-2101},
number = 2,
volume = 34,
place = {United States},
year = {Tue Mar 15 00:00:00 EDT 2016},
month = {Tue Mar 15 00:00:00 EDT 2016}
}