Photo-crystallization in a-Se layer structures: Effects of film-substrate interface-rigidity
- SUNY at Buffalo, Department of Physics, Buffalo, New York 14260-1500 (United States)
- SUNY at Buffalo, Department of Chemistry, Buffalo, New York 14260 (United States)
- Lakehead University, 955 Oliver Road, Thunder Bay, Ontario P7B 5E1 (Canada)
- University of Waterloo, Waterloo, Ontario N2L 3G1 (Canada)
- University of Saskatchewan, Saskatoon, Saskatchewan S7N 5A9 (Canada)
Amorphous selenium (a-Se) films deposited on rigid substrates can undergo photo-induced crystallization (PC) even at temperatures (T) well below the glass transition, T{sub g} ∼ 313 K. Substrate-generated shear strain is known to promote the PC process. In the present work, we explore the influence of different substrates (Si and glass), and different film-layer-substrate combinations, on the PC in a variety of a-Se films and film-structures. The intermediate layers (indium tin oxide and polyimide) are chosen to promote conductivity and/or to be a buffer against interface strain in structures of interest for digital imaging applications. The PC characteristics in these samples are evaluated and compared using optical microscopy, atomic-force microscopy, Raman mapping, and T-dependent Raman spectroscopy. Both the presence of a soft intermediate layer, and the thermal softening that occurs for T increasing through T{sub g}, inhibit the tendency for the onset of PC. The extensive PC mapping results in the wide range of samples studied here, as well as the suppression of PC near T{sub g} in this array of samples, strongly support the generality of this behavior. As a consequence, one may expect that the stability of a-Se films against PC can be enhanced by decreasing the rigidity of the film-substrate interface. In this regard, advanced film structures that employ flexible substrates, soft intermediate layers, and/or are designed to be operated near T{sub g} should be explored.
- OSTI ID:
- 22402660
- Journal Information:
- Journal of Applied Physics, Vol. 116, Issue 19; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
- Country of Publication:
- United States
- Language:
- English
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