Electronic cooling using thermoelectric devices

doi:10.1063/1.4921457

Title: Electronic cooling using thermoelectric devices

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Abstract

Thermoelectric coolers or Peltier coolers are used to pump heat in the opposite direction of the natural heat flux. These coolers have also been proposed for electronic cooling, wherein the aim is to pump heat in the natural heat flux direction and from hot spots to the colder ambient temperature. In this manuscript, we show that for such applications, one needs to use thermoelectric materials with large thermal conductivity and large power factor, instead of the traditionally used high ZT thermoelectric materials. We further show that with the known thermoelectric materials, the active cooling cannot compete with passive cooling, and one needs to explore a new set of materials to provide a cooling solution better than a regular copper heat sink. We propose a set of materials and directions for exploring possible materials candidates suitable for electronic cooling. Finally, to achieve maximum cooling, we propose to use thermoelectric elements as fins attached to copper blocks.

Authors:

Zebarjadi, M., E-mail: m.zebarjadi@rutgers.edu ^[1]; Institute of Advanced Materials, Devices, and Nanotechnology, Rutgers University, Piscataway, New Jersey 08854 ^[2]

Department of Mechanical and Aerospace Engineering, Rutgers University, Piscataway, New Jersey 08854 (United States)
(United States)

Publication Date:: Mon May 18 00:00:00 EDT 2015

OSTI Identifier:: 22402477

Resource Type:: Journal Article

Journal Name:: Applied Physics Letters

Additional Journal Information:: Journal Volume: 106; Journal Issue: 20; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); Journal ID: ISSN 0003-6951

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; COOLING; COPPER; HEAT EXCHANGERS; HEAT FLUX; MATHEMATICAL SOLUTIONS; THERMAL CONDUCTIVITY; THERMOELECTRIC COOLERS; THERMOELECTRIC MATERIALS

Citation Formats


                    Zebarjadi, M., E-mail: m.zebarjadi@rutgers.edu, and Institute of Advanced Materials, Devices, and Nanotechnology, Rutgers University, Piscataway, New Jersey 08854. Electronic cooling using thermoelectric devices.  United States: N. p., 2015. 
        Web.  doi:10.1063/1.4921457.

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                    Zebarjadi, M., E-mail: m.zebarjadi@rutgers.edu, & Institute of Advanced Materials, Devices, and Nanotechnology, Rutgers University, Piscataway, New Jersey 08854. Electronic cooling using thermoelectric devices.  United States.  https://doi.org/10.1063/1.4921457

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                    Zebarjadi, M., E-mail: m.zebarjadi@rutgers.edu, and Institute of Advanced Materials, Devices, and Nanotechnology, Rutgers University, Piscataway, New Jersey 08854. 2015.  
        "Electronic cooling using thermoelectric devices".  United States.  https://doi.org/10.1063/1.4921457.

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@article{osti_22402477,

  title        = {Electronic cooling using thermoelectric devices},

  author       = {Zebarjadi, M., E-mail: m.zebarjadi@rutgers.edu and Institute of Advanced Materials, Devices, and Nanotechnology, Rutgers University, Piscataway, New Jersey 08854},

  abstractNote = {Thermoelectric coolers or Peltier coolers are used to pump heat in the opposite direction of the natural heat flux. These coolers have also been proposed for electronic cooling, wherein the aim is to pump heat in the natural heat flux direction and from hot spots to the colder ambient temperature. In this manuscript, we show that for such applications, one needs to use thermoelectric materials with large thermal conductivity and large power factor, instead of the traditionally used high ZT thermoelectric materials. We further show that with the known thermoelectric materials, the active cooling cannot compete with passive cooling, and one needs to explore a new set of materials to provide a cooling solution better than a regular copper heat sink. We propose a set of materials and directions for exploring possible materials candidates suitable for electronic cooling. Finally, to achieve maximum cooling, we propose to use thermoelectric elements as fins attached to copper blocks.},

  doi          = {10.1063/1.4921457},

  url          = {https://www.osti.gov/biblio/22402477},
  journal      = {Applied Physics Letters},

  issn         = {0003-6951},

  number       = 20,

  volume       = 106,

  place        = {United States},

  year         = {Mon May 18 00:00:00 EDT 2015},

  month        = {Mon May 18 00:00:00 EDT 2015}

}

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