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Title: Using atomic layer deposited tungsten to increase thermal conductivity of a packed bed

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.4917309· OSTI ID:22398906
; ; ;  [1];  [2]
  1. Lawrence Livermore National Laboratory, 7000 East Ave, Livermore, California 94550 (United States)
  2. Department of Mechanical Engineering, University of Colorado, UCB 427, Boulder, Colorado 80309-0427 (United States)

This study investigated the effective thermal conductivity (k{sub eff}) of packed-beds that contained porous particles with nanoscale tungsten (W) films of different thicknesses formed by atomic layer deposition (ALD). A continuous film on the particles is vital towards increasing k{sub eff} of the packed beds. For example, the k{sub eff} of an alumina packed bed was increased by three times after an ∼8-nm continuous W film with 20 cycles of W ALD, whereas k{sub eff} was decreased on a polymer packed bed with discontinuous, evenly dispersed W-islands due to nanoparticle scattering of phonons. For catalysts, understanding the thermal properties of these packed beds is essential for developing thermally conductive supports as alternatives to structured supports.

OSTI ID:
22398906
Journal Information:
Applied Physics Letters, Vol. 106, Issue 15; Other Information: (c) 2015 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
Country of Publication:
United States
Language:
English