Phonon scattering in graphene over substrate steps

Journal Article · Mon Oct 13 00:00:00 EDT 2014 · Applied Physics Letters

DOI:https://doi.org/10.1063/1.4898066· OSTI ID:22350917

Sevinçli, H., E-mail: [e-mail] ^[1]; Department of Micro- and Nano-technology ^[2]; Brandbyge, M., E-mail: [e-mail] ^[3]; Center for Nanostructured Graphene ^[4]

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1. Department of Materials Science and Engineering, Izmir Institute of Technology, Gülbahçe Kampüsü, 35430 Urla, Izmir (Turkey)
2. (DTU Nanotech), Technical University of Denmark, DK-2800 Kongens Lyngby (Denmark)
3. Department of Micro- and Nano-technology (DTU Nanotech), Technical University of Denmark, DK-2800 Kongens Lyngby (Denmark)
4. (CNG), Department of Micro- and Nano-technology, Technical University of Denmark, DK-2800 Kongens Lyngby (Denmark)

We calculate the effect on phonon transport of substrate-induced bends in graphene. We consider bending induced by an abrupt kink in the substrate, and provide results for different step-heights and substrate interaction strengths. We find that individual substrate steps reduce thermal conductance in the range between 5% and 47%. We also consider the transmission across linear kinks formed by adsorption of atomic hydrogen at the bends and find that individual kinks suppress thermal conduction substantially, especially at high temperatures. Our analysis show that substrate irregularities can be detrimental for thermal conduction even for small step heights.

• OSTI ID: 22350917
• Journal Information: Applied Physics Letters, Vol. 105, Issue 15; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
ADSORPTION
COMPUTERIZED SIMULATION
GRAPHENE
INTERACTIONS
PHONONS
SCATTERING
SUBSTRATES
THERMAL CONDUCTION
TRANSMISSION