Investigating the nanostructure and thermal properties of chiral poly(amide-imide)/Al{sub 2}O{sub 3} compatibilized with 3-aminopropyltriethoxysilane
- Organic Polymer Chemistry Research Laboratory, Department of Chemistry, Isfahan University of Technology, Isfahan 84156-83111, Islamic Republic of Iran (Iran, Islamic Republic of)
Graphical abstract: - Highlights: • Chiral polymer with different functional groups was prepared in green route. • The surface of Al{sub 2}O{sub 3}-NPs was treated by KH550 as a silane coupling agent. • NCs of poly(amide-imide) and Al{sub 2}O{sub 3} were synthesized by ultrasonic irradiation. • TEM results show good dispersion of Al{sub 2}O{sub 3}-NPs in the poly(amide-imide) matrix. • The thermal and mechanical properties of the hybrid materials were improved. - Abstract: Novel chiral poly(amide-imide) (PAI)/Al{sub 2}O{sub 3} nanocomposites were prepared via incorporating surface modified Al{sub 2}O{sub 3} nanoparticles into polymer matrices for the first time. In the process of preparing the nanocomposites, severe aggregation of Al{sub 2}O{sub 3} nanoparticles could be reduced by surface modification and γ-aminopropyltriethoxysilane. The optically active PAI chains were formed from the polycondensation reaction of N,N′-(pyromellitoyl)-bis-phenylalanine diacid with 2-(3,5-diaminophenyl)-benzimidazole in green condition. The obtained polymer and inorganic metal oxide nanoparticles were used to prepare chiral PAI/Al{sub 2}O{sub 3} nanocomposites through ultrasonic irradiation. The resulting nanoparticle filled composites were also characterized by Fourier transform infrared spectroscopy, X-ray diffraction, field emission scanning electron microscopy, transmission electron microscopy and thermogravimetric analysis (TGA) techniques. TGA thermographs confirmed that the heat stability of the prepared nanoparticle-reinforced composites was improved. Mechanical properties showed that the film containing 10 wt% of modified Al{sub 2}O{sub 3} had a tensile strength of the order of 83.6 MPa, relative to the 64.3 MPa of the pure PAI.
- OSTI ID:
- 22285114
- Journal Information:
- Materials Research Bulletin, Vol. 48, Issue 10; Other Information: Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 0025-5408
- Country of Publication:
- United States
- Language:
- English
Similar Records
Structure and infrared emissivity of silicon-containing polyimide/BaTiO{sub 3} nanocomposite films
Designing Imidazolium Poly(amide-amide) and Poly(amide-imide) Ionenes and Their Interactions with Mono- and Tris(imidazolium) Ionic Liquids