Engineering the (In, Al, Ga)N back-barrier to achieve high channel-conductivity for extremely scaled channel-thicknesses in N-polar GaN high-electron-mobility-transistors
- Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106 (United States)
Scaling down the channel-thickness (t{sub ch}) in GaN/(In, Al, Ga)N high-electron-mobility-transistors (HEMTs) is essential to eliminating short-channel effects in sub 100 nm gate length HEMTs. However, this scaling can degrade both charge density (n{sub s}) and mobility (μ), thereby reducing channel-conductivity. In this study, the back-barrier design in N-polar GaN/(In, Al, Ga)N was engineered to achieve highly conductive-channels with t{sub ch} < 5-nm using metal organic chemical vapor deposition. Compositional-grading was found to be the most effective approach in reducing channel-conductivity for structures with t{sub ch} ∼ 3-nm. For a HEMT with 3-nm-thick-channel, a sheet-resistance of 329 Ω/◻ and a peak-transconductance of 718 mS/mm were demonstrated.
- OSTI ID:
- 22283045
- Journal Information:
- Applied Physics Letters, Vol. 104, Issue 9; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
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