skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Effect of growth temperature on ballistic electron transport through the Au/Si(001) interface

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.4873172· OSTI ID:22273490

Ballistic electron emission spectroscopy was used to investigate electron transport through Au/Si(001) Schottky diodes grown at 35 °C and 22 °C. Aside from a decreased Schottky height, this small increase in temperature introduced an energy dependent scattering component, which was absent in the samples grown at 22 °C. These differences may be attributed to the increased amount of Au-Si intermixing at the interface. Despite the non-epitaxial nature of the growth technique, strong evidence was found in both sets of samples that indicated the presence of a forward-focused current subject to some degree of parallel momentum conservation at the interface. This evidence was present in all samples grown at 35 °C, but was only observed in those samples grown at 22 °C when the Au films were 10 nm or thicker. This sensitivity to growth temperature could account for discrepancies in previous studies on Au/Si(001)

OSTI ID:
22273490
Journal Information:
Journal of Applied Physics, Vol. 115, Issue 16; Other Information: (c) 2014 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
Country of Publication:
United States
Language:
English