Patterned electrochemical deposition of copper using an electron beam

Journal Article · Sat Feb 01 00:00:00 EST 2014 · APL Materials

DOI:https://doi.org/10.1063/1.4863596· OSTI ID:22269562

Heijer, Mark den ^[1]; Shao, Ingrid; Reuter, Mark C.; Radisic, Alex ^[2]

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1. Kamerlingh Onnes Laboratory, Leiden University, P.O. Box 9504, 2300 RA Leiden (Netherlands)
2. IMEC, Kapeldreef 75, B-3001 Leuven (Belgium)

We describe a technique for patterning clusters of metal using electrochemical deposition. By operating an electrochemical cell in the transmission electron microscope, we deposit Cu on Au under potentiostatic conditions. For acidified copper sulphate electrolytes, nucleation occurs uniformly over the electrode. However, when chloride ions are added there is a range of applied potentials over which nucleation occurs only in areas irradiated by the electron beam. By scanning the beam we control nucleation to form patterns of deposited copper. We discuss the mechanism for this effect in terms of electron beam-induced reactions with copper chloride, and consider possible applications.

• OSTI ID: 22269562
• Journal Information: APL Materials, Vol. 2, Issue 2; Other Information: (c) 2014 Author(s); Country of input: International Atomic Energy Agency (IAEA); ISSN 2166-532X
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CHLORINE IONS
CONTROL
COPPER
COPPER CHLORIDES
DEPOSITS
ELECTROCHEMICAL CELLS
ELECTRODEPOSITION
ELECTRODES
ELECTROLYTES
ELECTRON BEAMS
IRRADIATION
NUCLEATION
SULFATES
TRANSMISSION ELECTRON MICROSCOPY